7075-T6 Aluminum DLC Precision Electrode Holders: Achieving ±0.001mm Tolerance and Improving Delivery Efficiency by 40%
For manufacturers of plasma etching equipment, precision is not a luxury—it is a necessity. This case study details how Yijin Solution partnered with Vextron Semiconductor to overcome a critical bottleneck in manufacturing Precision Electrode Holders. By transitioning to Yijin Solution’s optimized 5-axis CNC process and proprietary stress-relief protocols, Vextron achieved a stable tolerance of ±0.001mm, reduced defect rates from 8% to 0.3%, and accelerated delivery cycles by 40%.
About the Client: Vextron Semiconductor
Headquartered in California, Vextron Semiconductor is a prominent player in the semiconductor equipment sector. They specialize in providing high-end plasma etching and thin-film deposition equipment for major chip manufacturers like Intel and TSMC. With an annual production capacity of approximately 200 core units, Vextron demands a supply chain that matches the rigorous pace of Silicon Valley innovation.
The Challenge: Precision Instability & Supply Chain Disruption
Vextron required a custom “Precision Electrode Holder” for their etching machines. The specifications were demanding: 7075-T6 Aluminum substrate, DLC (Diamond-Like Carbon) coating, and a geometric tolerance of ±0.001mm.
However, their existing supply chain was failing to meet these demands, creating four critical pain points:
- The Precision Gap: The inner hole tooth shape and surface flatness required ±0.001mm tolerance. Previous suppliers could only achieve ±0.003mm, causing uneven contact between the electrode and wafer, threatening the stability of the entire etching process.
- Material Deformation: 7075 Aluminum is prone to internal stress. Thin-walled components (2.5mm min) were deforming by over 0.005mm after machining.
- Coating Failures: Inconsistent DLC coating thickness (±0.5μm deviation) from previous vendors reduced the component’s corrosion resistance life by 30%.
- Inefficiency: With a defect rate of over 8% and erratic delivery schedules (up to 12 weeks for some batches), Vextron’s assembly line faced constant delays.
“We tried local suppliers in the US/EU, but costs exceeded our budget by 80%. We tried generic Asian shops, but the DLC consistency wasn’t there. We needed a partner who understood both precision machining and surface engineering.”
Why Choose Yijin Solution
Vextron Semiconductor discovered Yijin Solution through LinkedIn and semiconductor supply chain exhibitions and selected Yijin Solution based on:
- Proven ±0.001mm machining capability with integrated five-axis CNC + DLC coating
- Experience with EU & U.S. semiconductor compliance, including material traceability and documentation
- Fast and flexible production, supporting batch sizes from 100 to 10,000 units
- A unique approach combining custom tooling and pre-machining tooth profile optimization to prevent deformation in 7075-T6 aluminum
The Solution: A 4-Stage Precision Engineering Protocol
To meet Vextron’s stringent requirements for the Electrode Holder, Yijin Solution moved beyond standard machining, implementing a specialized “Process-First” manufacturing strategy.
Digital Engineering & DFM Optimization
Before production, we focused on risk elimination through digital simulation and design optimization:
- Mastercam Simulation: We utilized Mastercam CAD/CAM to simulate the entire 5-axis tool path. This allowed us to optimize cutting angles in advance, preventing the risk of thin-wall deformation common in 7075 aluminum.
- Proactive DFM: Our engineers recommended a slight modification to the internal chip evacuation groove. This design tweak reduced cutting chatter significantly without altering the component’s functionality.
5-Axis Precision & Stress Management
We deployed a dedicated manufacturing cell to ensure geometric stability:
- Advanced Equipment: Utilizing DMG MORI 5-axis machining centers, we achieved one-time clamping for complex tooth profiles and internal holes. This single-setup approach minimized cumulative errors.
- Custom Fixturing: Developed a hybrid fixture combining vacuum adsorption and positioning pins, achieving a clamping repeatability accuracy of ±0.0005mm.
- Stress Relief (Crucial Step): To counteract the residual stress in 7075-T6 aluminum, we implemented a 4-stage process: Roughing → Semi-finishing → Artificial Aging (120℃ for 4 hours) → Finishing. This thermal treatment effectively eliminated cutting stress, ensuring the part stayed within tolerance after removal from the machine.
Surface Integrity & DLC Coating
Achieving the ±0.001mm tolerance required specific attention to surface quality and coating thickness:
- Micro-Cutting with PCD: We switched to Polycrystalline Diamond (PCD) tooling paired with a specialized high-lubricity cutting fluid. This combination reduced thermal deformation and achieved a surface roughness of Ra ≤ 0.02μm, providing an ideal anchor for coating adhesion.
- Coating Compensation: A precise machining allowance of 0.002mm was reserved to account for the DLC layer.
- Proprietary DLC Process: Our self-controlled DLC coating process maintained a film thickness deviation within ±0.2μm, ensuring consistent corrosion resistance and precise final dimensions.
Semiconductor-Grade Quality Assurance
- Zeiss Verification: 10% of every batch undergoes full-dimensional inspection using a Zeiss CMM (Coordinate Measuring Machine) to guarantee the ±0.001mm tolerance.
- Full Traceability (ISO 9001): As an ISO 9001 certified partner, we provided Vextron with complete traceability documentation, including raw material heat numbers, detailed processing parameters, and coating test reports for every shipment.
Key Results: Precision Delivered at Speed
By switching to Yijin Solution, Vextron Semiconductor transformed a production bottleneck into a competitive advantage.
Precision & Quality
- Tolerance stabilized at ±0.001mm
- Defect rate reduced from 8% → 0.3%
- DLC coating consistency improved by >60%
Efficiency & Cost
- Lead time reduced from 4 weeks → 2.4 weeks (40% faster)
- Material waste reduced from 15% → 3%
- Material cost savings of approximately 12%
Business Outcomes
- On-time equipment delivery improved from 75% → 99.5%
- Vextron increased order volume by 50%
- Two additional precision component projects were awarded to Yijin Solution
Customer Reviews
Yijin Solution’s precision machining capabilities solved our bottleneck of the past six months—tolerance stability of ±0.001mm and a delivery cycle of 2.4 weeks, increasing our etching equipment capacity by 30%. In particular, the consistency of the DLC coating directly extended the electrode’s lifespan.
—Mark Taylor, Engineering Operations Manager, Vextron Semiconductor
Need Semiconductor-Grade Precision?
Through this project, we proved that you do not have to choose between speed and precision. By integrating 5-axis machining with proprietary stress-relief and coating technologies, Yijin Solution solved the pain points that local suppliers and generic shops could not.
Are you a manufacturer in the semiconductor or aerospace sector facing challenges with complex aluminum parts or specialized coatings?
Don’t let machining tolerances slow down your innovation. Contact Yijin Solution today for a manufacturability review and a custom quote within 24 hours.
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